|
| SPECIFICATIONS
|
|
| Movement
and Accuracy |
| Y Axis |
| Total
Motion |
|
8.27
to 12 inch (option) |
| Index
Repeatability |
|
.25
um |
| Accumulative
Error |
|
None
|
| Minimum
Index |
|
.25
um |
|
| X
Axis |
| Repeatability
|
|
.25
um |
| Accumulative
Error |
|
None
|
| Return
Speed Max |
|
12
inches/Sec. |
| Z
Axis |
| Repeatability
|
|
.25
um |
| Accumulative
Error |
|
None
|
| Theta
Axis Rotation |
|
>360
Degrees
+/- 2 arc seconds |
|
| Scribe Tool |
| Scribe
Tool |
|
Diamond
tip |
| Angle of
Attack |
|
<
2 degrees computer programmable |
| Tip pressure
Control & Resolution |
|
Resolution: 0.01
gm
Range: 5 gm-150 gm
Repeatability:
+/- 0.1 gm with Z-1 movement of
0.050 inch
Positioned w/Air Bearing
Slide |
| Pressure
Readout |
|
Realtime
display |
|
 |
|
|
|
Welcome
to a new advanced Scribe & Fracture system designed from
the ground up to improve process throughput, yield, accuracy
and reliability using a dustless, water-free process.
How it works:
A wafer is mounted on a Diamond Touch patented DiaFrame™
wafer carrier.
Using the Diamond Touch DS scribing machine
or, in the case of very hard surfaces such as silicon carbide,
a DS saw, the wafer is scribed, causing a micro-seed fracture
approximately 4-10 um deep below each scribe line.
A metered puff of clean air through the pourous
chuck causes the DiaFrame™ to return to its relaxed,
domed shape and, at supersonic speed, fractures all
the scribe lines
along each scribe line.
Scribe
& Fracture Microphotographs. Click image for larger view.
System description
The
entire system has been designed with off-the-shelf components.
Standard Intel- based microprocessors, stepper motors and
even the power supplies. Inherent incorporation of hardware
plug and play service eases service and results in highest
available MTBF (>2500 hours) and shortest MTTR (<2.5 hours).
Chuck table Vacuum hold down
for Diamond Touch DiaFrame™
Wafer Mount
DiaFrame™ used with 4-, 6- and 8-inch wafers
Work chuck sizes:
4" (100 mm), 6" (150 mm), 8" (200 mm). To
300mm
Air bearing Slides for X- and Y- Axes
Video microscope and Color
camera subsystem 120X or greater displaying 12.1" Color
Flat Panel Display with a dual line B/W reticle generator
Solid state hard drives Replaces
mechanical devices and assures increased reliability
Software interfaces Color-FPD
Password protection
Log and event file Available on display, 3 1/2" floppy
or on LAN for all wafers processed
Self-diagnostic routines Displayed
and reported on LAN and 3 1/2" floppy in real time
and in historical reporting
Axis speed programming Individually,
independent
Command & control functions
Entry through color-FPD touch-screen
Programmable off-line software
Included, download 3 ½ diskette or direct communications
of the fab LAN.
Facilities
Vacuum 20 in Hg minimum
Air Pressure 80 PSIG +/- 10 PSI
Air Flow Rate: <1 CFM
Air Purity <5 Micron
Ambient Temperature 50-80 Degrees F
General
Dimensions 31" W 32"D 24"H
Weight 800 Lbs.
Power 110 VAC 50/60 Hz
Current 20 Amps
|
